发明申请
- 专利标题： Chip cooling channels formed in wafer bonding gap
- 专利标题（中）： 在晶片接合间隙中形成的芯片冷却通道
-
申请号： US11701317申请日： 2007-01-31
-
公开(公告)号： US20080179736A1公开(公告)日： 2008-07-31
- 发明人: Peter G. Hartwell , Duncan Stewart
- 申请人： Peter G. Hartwell , Duncan Stewart
- 主分类号： H01L23/34
- IPC分类号： H01L23/34 ; H01L21/00
摘要：
One embodiment in accordance with the invention is a system that can include a first wafer and a second wafer. The first wafer and the second wafer can be bonded together by a wafer bonding process that forms a gap between the first wafer and the second wafer. The gap can be configured for receiving a heat extracting material.
公开/授权文献
- US08030754B2 Chip cooling channels formed in wafer bonding gap 公开/授权日：2011-10-04
信息查询
IPC分类:
