发明申请
- 专利标题: Laser processing method and laser processing apparatus
- 专利标题(中): 激光加工方法和激光加工设备
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申请号: US11902966申请日: 2007-09-26
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公开(公告)号: US20080180788A1公开(公告)日: 2008-07-31
- 发明人: Motoki Kakui , Keiji Fuse
- 申请人: Motoki Kakui , Keiji Fuse
- 申请人地址: JP Osaka
- 专利权人: Sumitomo Electric Industries, Ltd.
- 当前专利权人: Sumitomo Electric Industries, Ltd.
- 当前专利权人地址: JP Osaka
- 优先权: JPP2006-264936 20060928
- 主分类号: H01S3/09
- IPC分类号: H01S3/09
摘要:
The present invention relates to a laser processing method and laser processing apparatus for enabling improvement and maintenance of homogenization of a beam intensity distribution in an irradiated region. The laser processing apparatus comprises, at least, an ASE light generation section for emitting ASE light, and a homogenizer for splitting the ASE light into multiple beams. The ASE generation section for emitting the ASE light as processing laser light is provided, and whereby the deterioration of homogenization due to inter-beam interference is suppressed. The homogenization of beam intensity distribution is improved by locating a condenser lens relative to an object such that the object is shifted from a focus position of the condenser lens in the homogenizer, by intentionally deteriorating a beam quality M2 of the ASE light itself emitted from the ASE light generation section to about 2 to 10, or by a combination of these, in laser processing.
公开/授权文献
- US07907341B2 Laser processing method and laser processing apparatus 公开/授权日:2011-03-15
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