发明申请
- 专利标题： Compliant Penetrating Packaging Interconnect
- 专利标题（中）： 符合渗透包装互连
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申请号： US11627430申请日： 2007-01-26
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公开(公告)号： US20080180927A1公开(公告)日： 2008-07-31
- 发明人: Paul Coteus , Gareth Geoffrey Hougham , Brian R. Sundlof
- 申请人： Paul Coteus , Gareth Geoffrey Hougham , Brian R. Sundlof
- 主分类号： H05K7/10
- IPC分类号： H05K7/10 ; H05K3/30
摘要：
A circuit package is provided. The circuit package includes a plurality of electrically conductive pads located on a bottom surface of the circuit package, wherein at least one pad of the plurality of bottom surface pads has a recession for receiving an electrically conductive protrusion located on a substrate to which the circuit package is to be mounted.
公开/授权文献
- US07897878B2 Compliant penetrating packaging interconnect 公开/授权日：2011-03-01
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