发明申请

  • 专利标题: OPTOELECTRONIC INTERCONNECTION BOARD, OPTOELECTRONIC INTERCONNECTION APPARATUS, AND MANUFACTURING METHOD THEREOF
  • 专利标题(中): 光电互连板,光电互连装置及其制造方法
  • 申请号: US11942238
    申请日: 2007-11-19
  • 公开(公告)号: US20080181561A1
    公开(公告)日: 2008-07-31
  • 发明人: Hideto FURUYAMA
  • 申请人: Hideto FURUYAMA
  • 优先权: JP2006-350007 20061226
  • 主分类号: G02B6/42
  • IPC分类号: G02B6/42
OPTOELECTRONIC INTERCONNECTION BOARD, OPTOELECTRONIC INTERCONNECTION APPARATUS, AND MANUFACTURING METHOD THEREOF
摘要:
An optoelectronic interconnection board on which an optical semiconductor device can be mounted, an optoelectronic interconnection apparatus using the optoelectronic interconnection board, and a manufacturing method thereof are disclosed. According to one aspect of the present invention, there is provided an optoelectronic interconnection board including optical interconnection lines having optical waveguides and electric interconnection lines formed of an electroconductive material, includes a main optical waveguide through which an optical signal is transmitted when an optical functional device is disposed on the optoelectronic interconnection board, a main optical input/output portion which transmits/receives the optical signal to/from the main optical waveguide, a monitoring optical input/output portion which is provided to align with the main optical input/output portion and transmits/receives light to/from the monitoring optical waveguide.
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