发明申请
- 专利标题： Self-aligned air-gap in interconnect structures
- 专利标题（中）： 互连结构中的自对准气隙
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申请号： US11698565申请日： 2007-01-26
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公开(公告)号： US20080182405A1公开(公告)日： 2008-07-31
- 发明人: Chung-Shi Liu , Chen-Hua Yu
- 申请人： Chung-Shi Liu , Chen-Hua Yu
- 主分类号： H01L21/4763
- IPC分类号： H01L21/4763
摘要：
An integrated circuit structure comprising an air gap and methods for forming the same are provided. The integrated circuit structure includes a conductive line; a self-aligned dielectric layer on a sidewall of the conductive line; an air-gap horizontally adjoining the self-aligned dielectric layer; a low-k dielectric layer horizontally adjoining the air-gap; and a dielectric layer on the air-gap and the low-k dielectric layer.
公开/授权文献
- US07871923B2 Self-aligned air-gap in interconnect structures 公开/授权日：2011-01-18