发明申请
US20080186623A1 GROUND VIAS FOR ENHANCED PREAMP HEAT RELEASE IN HARD DISK DRIVES
有权
用于硬盘驱动器中增强预热释放的地面VIAS
- 专利标题: GROUND VIAS FOR ENHANCED PREAMP HEAT RELEASE IN HARD DISK DRIVES
- 专利标题(中): 用于硬盘驱动器中增强预热释放的地面VIAS
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申请号: US12024857申请日: 2008-02-01
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公开(公告)号: US20080186623A1公开(公告)日: 2008-08-07
- 发明人: Alex Cayaban , Szu-Han Hu , Yasunari Ooyabu , Martin John McCaslin
- 申请人: Alex Cayaban , Szu-Han Hu , Yasunari Ooyabu , Martin John McCaslin
- 主分类号: G11B33/14
- IPC分类号: G11B33/14
摘要:
Described is a preamp flex cable for use in a hard drive. The flex cable incorporates a stiffener layer operable to provide a mechanical support, an insulating layer provided over the stiffener layer and having at least one via provided therein to expose the stiffener layer, and at least one conductive layer provided over the insulating layer. The at least one conductive layer forms an electrical circuit and at least one heat removing element that extends through the via and establishes a contact with the stiffener layer. In one implementation, the heat removing element includes a rectangular plate having a recessed center portion and an edge portion. The recessed center portion protrudes through the at least one via in the insulating layer to mechanically couple with the stiffener. In another implementation, the heat removing element includes first portion and second rectangular portions. The first portion protrudes through the at least one via in the insulating layer to thermally couple with the stiffener and the second portion is disposed over the insulating layer, such that the second portion can be thermally coupled to the preamp.
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