发明申请
US20080187731A1 Techniques for Patterning Features in Semiconductor Devices 审中-公开
半导体器件中图形特征的技术

Techniques for Patterning Features in Semiconductor Devices
摘要:
Techniques for semiconductor processing are provided. In one aspect, a method for patterning one or more features in a semiconductor device comprises the following step. At least one critical dimension of the one or more features is reduced during etching of the antireflective material. A lithographic structure is also provided.
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