发明申请
- 专利标题: Prepreg and laminate
- 专利标题(中): 预浸料和层压板
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申请号: US12068298申请日: 2008-02-05
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公开(公告)号: US20080187763A1公开(公告)日: 2008-08-07
- 发明人: Yoshihiro Kato , Masayoshi Ueno , Takeshi Nobukuni
- 申请人: Yoshihiro Kato , Masayoshi Ueno , Takeshi Nobukuni
- 优先权: JP2007-028117 20070207; JP2007-186929 20070718
- 主分类号: B32B15/092
- IPC分类号: B32B15/092 ; C08K3/10
摘要:
A prepreg, for printed wiring boards, comprising a flame resistant resin composition containing a specific cyanate ester resin, a nonhalogen epoxy resin, boehmite which is hardly soluble in acids or alkalis and a silicone powder which is a flame retardant assistant, and a base material, which prepreg retains high-degree flame resistance without a halogen compound and has excellent resistance to chemical, high glass transition temperature, excellent soldering heat resistance and excellent heat resistance after moisture absorption, and a laminate or metal-foil-clad laminate obtained by curing the above prepreg.
公开/授权文献
- US07601429B2 Prepreg and laminate 公开/授权日:2009-10-13