发明申请
- 专利标题： Wired circuit board and method for producing the same
- 专利标题（中）： 有线电路板及其制造方法
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申请号： US12068609申请日： 2008-02-08
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公开(公告)号： US20080190652A1公开(公告)日： 2008-08-14
- 发明人: Katsutoshi Kamei , Kazuya Nakamura , Visit Thaveeprungsriporn
- 申请人： Katsutoshi Kamei , Kazuya Nakamura , Visit Thaveeprungsriporn
- 申请人地址： JP Osaka
- 专利权人： Nitto Denko Corporation
- 当前专利权人： Nitto Denko Corporation
- 当前专利权人地址： JP Osaka
- 优先权： JP2007-031137 20070209
- 主分类号： H05K1/00
- IPC分类号： H05K1/00
摘要：
A wired circuit board includes: a first insulating layer; a conductive pattern formed on the first insulating layer and having a terminal portion; and a second insulating layer formed on the first insulating layer to cover the conductive pattern. A surface of the terminal portion is formed to be exposed from the first insulating layer and the second insulating layer. A tin alloy layer is formed at least on a top surface and both side surfaces of the terminal portion.
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