Quartz glass components for use in semiconductor manufacture are produced by mechanically machining the surface of a quartz glass blank so as to produce an initial average surface roughness Ra,0. The thus machined component surface is then cleaned in an etching solution. The invention relates to the optimisation of particle formation on such components, during the first intended use already. It is proposed to produce an initial average surface roughness Ra,0 of at least 0.2 μm by mechanical machining, and to adjust etching intensity and duration so that an actual etching depth of at least 10 μm is achieved. A quartz glass component produced by this process for use in semiconductor manufacture is characterised in that it comprises, before its first intended use, a surface produced by mechanical machining and etching having an etched structure with an average surface roughness Ra,1 ranging from 0.6 μm to 8 μm, and in that a weight loss of less than 0.4 μg/(mm2×min) which is substantially constant in time is achieved when etching the component with a 10% solution of hydrofluoric acid.