A polyimide film having enhanced surface activity and improved surface adhesion, and a polyimide film having a metal film in which the metal film is bonded to the polyimide film with practically accepted high bonding strength are provided by a polyimide film having, at least on one surface, a coated particle layer comprising inorganic particles having a mean particle size of 1,000 nm or less which are coated with a metal oxide layer via an intervening layer comprising a mixture of the same metal oxide as above and polyimide, and the polyimide film having a metal film placed on the coated particle layer.