发明申请
- 专利标题: Method For Producing a Hole and Associated Device
- 专利标题(中): 生产孔和相关设备的方法
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申请号: US11795284申请日: 2005-12-21
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公开(公告)号: US20080197120A1公开(公告)日: 2008-08-21
- 发明人: Thomas Beck , Silke Settegast , Lutz Wolkers
- 申请人: Thomas Beck , Silke Settegast , Lutz Wolkers
- 申请人地址: DE MUENCHEN
- 专利权人: SIEMENS AKTIENGESELLSCHAFT
- 当前专利权人: SIEMENS AKTIENGESELLSCHAFT
- 当前专利权人地址: DE MUENCHEN
- 优先权: EP05000729.3 20050114
- 国际申请: PCT/EP05/57030 WO 20051221
- 主分类号: B23K26/38
- IPC分类号: B23K26/38
摘要:
Conventional methods for producing a hole in a component make use of special lasers with short laser pulse lengths. The aim of the invention is to reduce the time and money required for producing a hole. According to the inventive method, the laser pulse lengths are varied, short laser pulse lengths only being used in the area to be removed in which an influence on the throughflow or exhaust behavior is noticeable. This is, e.g., the inner surface of a diffuser of a hole that can be produced in a very precise manner using short laser pulse lengths.
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