发明申请
US20080197218A1 Dispersing or milling apparatus, and dispersing or milling method using same
有权
分散或研磨设备,以及分散或研磨方法使用
- 专利标题: Dispersing or milling apparatus, and dispersing or milling method using same
- 专利标题(中): 分散或研磨设备,以及分散或研磨方法使用
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申请号: US12070324申请日: 2008-02-14
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公开(公告)号: US20080197218A1公开(公告)日: 2008-08-21
- 发明人: Takamasa Ishigaki , Ji-Guang Li , Kimitoshi Sato , Hidehiro Kamiya , Yoshitaka Inoue , Choji Hatsugai , Takashi Suzuki
- 申请人: Takamasa Ishigaki , Ji-Guang Li , Kimitoshi Sato , Hidehiro Kamiya , Yoshitaka Inoue , Choji Hatsugai , Takashi Suzuki
- 优先权: JP2007-039179 20070220
- 主分类号: B02C19/18
- IPC分类号: B02C19/18 ; B02C17/16
摘要:
A material to be treated containing solid particles in a liquid is stirred together with milling media, and irradiated with ultrasonic waves during stirring to finely mill the solid particles to nanometer size and disperse the solid particles in the liquid. The ultrasonic waves create cavitation in the liquid and upon decay of the cavitation, shock waves are produced that cause the solid particles to vigorously collide with one another and with the milling media and these collisions, together with the shearing forces created by collision of the milling media, can produce on a commercial scale nano particles having an average particle size of at most 100 nm.
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