发明申请
US20080197466A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF 审中-公开
半导体器件及其制造方法

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
摘要:
A semiconductor device includes: a semiconductor chip; a plurality of pellet-like electrically conductive members connected to electrodes of the semiconductor chip; and an encapsulation resin that encapsulates the semiconductor chip and the electrically conductive members. The electrically conductive members are embedded into the encapsulation resin. Surfaces of the electrically conductive members are exposed from the encapsulation resin so that the electrically conductive members serve as external connection terminals of the semiconductor device.
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