发明申请
- 专利标题: SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- 专利标题(中): 半导体器件及其制造方法
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申请号: US12111379申请日: 2008-04-29
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公开(公告)号: US20080197466A1公开(公告)日: 2008-08-21
- 发明人: Ryuji NOMOTO , Yoshitaka AIBA
- 申请人: Ryuji NOMOTO , Yoshitaka AIBA
- 申请人地址: JP Kawasaki-shi
- 专利权人: FUJITSU LIMITED
- 当前专利权人: FUJITSU LIMITED
- 当前专利权人地址: JP Kawasaki-shi
- 主分类号: H01L23/495
- IPC分类号: H01L23/495
摘要:
A semiconductor device includes: a semiconductor chip; a plurality of pellet-like electrically conductive members connected to electrodes of the semiconductor chip; and an encapsulation resin that encapsulates the semiconductor chip and the electrically conductive members. The electrically conductive members are embedded into the encapsulation resin. Surfaces of the electrically conductive members are exposed from the encapsulation resin so that the electrically conductive members serve as external connection terminals of the semiconductor device.
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