Invention Application
- Patent Title: SELF ORIENTING MICRO PLATES OF THERMALLY CONDUCTING MATERIAL AS COMPONENT IN THERMAL PASTE OR ADHESIVE
- Patent Title (中): 自热导热材料作为热熔胶或粘合剂中的组分的微板
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Application No.: US12039309Application Date: 2008-02-28
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Publication No.: US20080202386A1Publication Date: 2008-08-28
- Inventor: Gareth Hougham , Paul A. Lauro , Brian R. Sundlof , Jeffrey D. Gelorme
- Applicant: Gareth Hougham , Paul A. Lauro , Brian R. Sundlof , Jeffrey D. Gelorme
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Main IPC: C09C1/44
- IPC: C09C1/44 ; C09K5/10
Abstract:
The present invention relates generally to thermally-conductive pastes for use with integrated circuits, and particularly, but not by way of limitation, to self-orienting microplates of graphite.
Public/Granted literature
- US07708909B2 Self orienting micro plates of thermally conducting material as component in thermal paste or adhesive Public/Granted day:2010-05-04
Information query
