发明申请
- 专利标题： Multi-substrate size vacuum processing tool
- 专利标题（中）： 多基板尺寸真空加工工具
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申请号： US11711502申请日： 2007-02-27
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公开(公告)号： US20080202410A1公开(公告)日： 2008-08-28
- 发明人: John M. Smith , James Carter Hall , Jeffrey G. Ellison
- 申请人： John M. Smith , James Carter Hall , Jeffrey G. Ellison
- 主分类号： C23C14/56
- IPC分类号： C23C14/56
摘要：
A substrate processing apparatus is described. The apparatus includes a substrate load lock chamber. A substrate transfer chamber is vacuum coupled to the substrate load lock chamber. A plurality of process chamber modules are vacuum coupled to the substrate transfer chamber. The apparatus may process semiconductor substrates with a selected diameter in a range from about 100 mm to about 450 mm.
信息查询
IPC分类:
