Invention Application
US20080206919A1 METHOD OF MANUFACTURE OF A MICROLENS STRUCTURE FOR OPTO-ELECTRIC SEMICONDUCTOR DEVICE 审中-公开
用于光电半导体器件的微结构结构的制造方法

  • Patent Title: METHOD OF MANUFACTURE OF A MICROLENS STRUCTURE FOR OPTO-ELECTRIC SEMICONDUCTOR DEVICE
  • Patent Title (中): 用于光电半导体器件的微结构结构的制造方法
  • Application No.: US12111061
    Application Date: 2008-04-28
  • Publication No.: US20080206919A1
    Publication Date: 2008-08-28
  • Inventor: Fuchao WangMing Fang
  • Applicant: Fuchao WangMing Fang
  • Applicant Address: US TX Carrollton
  • Assignee: STMICROELECTRONICS, INC.
  • Current Assignee: STMICROELECTRONICS, INC.
  • Current Assignee Address: US TX Carrollton
  • Main IPC: H01L21/00
  • IPC: H01L21/00
METHOD OF MANUFACTURE OF A MICROLENS STRUCTURE FOR OPTO-ELECTRIC SEMICONDUCTOR DEVICE
Abstract:
A semiconductor device includes a semiconductor material substrate, an opto-electric component formed on the substrate, and a first transparent layer formed on an upper surface of the substrate over the component, the layer having a planar upper surface with a cavity formed therein. The first transparent layer has a selected thickness and a first index of refraction. The semiconductor device further includes a lens having a second index of refraction, the lens being formed in the cavity by flowing a flowable dielectric over the substrate. An upper surface of the lens and the upper surface of the transparent layer may be coplanar, or alternatively, they may lie in separate planes. The semiconductor device may also include a second transparent layer formed over the first layer and lens, as a passivation layer.
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