发明申请
- 专利标题: METHODS OF FORMING WIRING TO TRANSISTOR AND RELATED TRANSISTOR
- 专利标题(中): 形成晶体管和相关晶体管的方法
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申请号: US11677598申请日: 2007-02-22
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公开(公告)号: US20080206977A1公开(公告)日: 2008-08-28
- 发明人: David J. Frank , Douglas C. La Tulipe , Steven E. Steen , Anna W. Topol
- 申请人: David J. Frank , Douglas C. La Tulipe , Steven E. Steen , Anna W. Topol
- 主分类号: H01L21/44
- IPC分类号: H01L21/44
摘要:
Methods of wiring to a transistor and a related transistor are disclosed. In one embodiment, the method includes a method of forming wiring to a transistor, the method comprising: forming a transistor on a semiconductor-on-insulator (SOI) substrate using masks that are mirror images of an intended layout, the forming including forming a gate and a source/drain region for each and a channel, the SOI substrate including a semiconductor-on-insulator (SOI) layer, a buried insulator layer and a silicon substrate; forming a dielectric layer over the transistor; bonding the dielectric layer to another substrate; removing the silicon substrate from the SOI substrate to the buried insulator layer; forming a contact to each of the source/drain region and the gate from a channel side of the gate; and forming at least one wiring to the contacts on the channel side of the gate.
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