发明申请
US20080210546A1 Sputtering apparatus, method for producing a transparent electroconductive film 审中-公开
溅射装置,透明导电膜的制造方法

Sputtering apparatus, method for producing a transparent electroconductive film
摘要:
A transparent electroconductive film having a small resistance value and a high transmittance and causing no damage upon an underlying organic EL film is formed. First and second targets are spaced and arranged in parallel, and a shielding plate is provided between the space and a transporting path for an object to be film-formed. Sputtered particles are allowed to reach the object through a release hole formed at the shielding plate. The sputtering particles obliquely irradiated are shielded by the shielding plate so that the transparent electroconductive film having a low resistivity and high transmittance can be formed.
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