发明申请
- 专利标题: Electroless plating in microchannels
- 专利标题(中): 微通道中的化学镀
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申请号: US11549625申请日: 2006-10-13
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公开(公告)号: US20080214884A1公开(公告)日: 2008-09-04
- 发明人: Francis P. Daly , Richard Long , Junko Ida , Rachid Taha , Terry Mazanec , Barry L. Yang
- 申请人: Francis P. Daly , Richard Long , Junko Ida , Rachid Taha , Terry Mazanec , Barry L. Yang
- 申请人地址: US OH Plain City
- 专利权人: VELOCYS INC.
- 当前专利权人: VELOCYS INC.
- 当前专利权人地址: US OH Plain City
- 主分类号: B01J23/42
- IPC分类号: B01J23/42 ; B01J8/02 ; B05D1/00 ; C07C5/00
摘要:
Novel methods of electroless plating are described. Catalyst coatings can be applied within microchannel apparatus. Various reactions, including combustion and steam reforming, can be conducted over electroless catalyst coatings.
公开/授权文献
- US08648006B2 Electroless plating in microchannels 公开/授权日:2014-02-11