发明申请
- 专利标题: Evaluation method of fine pattern feature, its equipment, and method of semiconductor device fabrication
- 专利标题(中): 精细图案特征,其设备和半导体器件制造方法的评估方法
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申请号: US12078840申请日: 2008-04-07
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公开(公告)号: US20080215274A1公开(公告)日: 2008-09-04
- 发明人: Atsuko Yamaguchi , Hiroshi Fukuda , Hiroki Kawada , Tatsuya Maeda
- 申请人: Atsuko Yamaguchi , Hiroshi Fukuda , Hiroki Kawada , Tatsuya Maeda
- 专利权人: Hitachi High-Technologies Corporation.
- 当前专利权人: Hitachi High-Technologies Corporation.
- 优先权: JP2004-222737 20040730
- 主分类号: G06F17/18
- IPC分类号: G06F17/18 ; G06F19/00 ; G01N23/22
摘要:
Equipment extracts components of spatial frequency that need to be evaluated in manufacturing a device or in analyzing a material or process out of edge roughness on fine line patterns and displays them as indexes. The equipment acquires data of edge roughness over a sufficiently long area, integrates a components corresponding to a spatial frequency region being set on a power spectrum by the operator, and displays them on a length measuring SEM. Alternatively, the equipment divides the edge roughness data of the sufficiently long area, computes long-period roughness and short-period roughness that correspond to an arbitrary inspection area by performing statistical processing and fitting based on theoretical calculation, and displays them on the length measuring SEM.
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