发明申请
- 专利标题： Apparatus and method for drying semiconductor substrates
- 专利标题（中）： 用于干燥半导体衬底的装置和方法
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申请号： US12078554申请日： 2008-04-01
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公开(公告)号： US20080216347A1公开(公告)日： 2008-09-11
- 发明人: Hun-Jung Yi , Sang-Oh Park
- 申请人： Hun-Jung Yi , Sang-Oh Park
- 优先权： KR2003-0077781 20031104
- 主分类号： F26B3/00
- IPC分类号： F26B3/00
摘要：
A drying apparatus and method of drying a wafer including supplying a drying material for drying a wafer and controlling a flow of the drying material to uniformly or substantially uniformly dry the wafer. The flow of the drying material may be controlled by a vent unit including at least one part for controlling the flow of the drying material to uniformly or substantially uniformly dry the wafer.
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