发明申请
- 专利标题： LEADFRAME TREATMENT FOR ENHANCING ADHESION OF ENCAPSULANT THERETO
- 专利标题（中）： 用于增强粘合剂的粘合剂的治疗
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申请号： US11683234申请日： 2007-03-07
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公开(公告)号： US20080216921A1公开(公告)日： 2008-09-11
- 发明人: Yiu Fai KWAN , Tat Chi CHAN , Wai CHAN , Chi Chung LEE
- 申请人： Yiu Fai KWAN , Tat Chi CHAN , Wai CHAN , Chi Chung LEE
- 主分类号： C22C1/00
- IPC分类号： C22C1/00
摘要：
A method is provided for treating a leadframe comprising copper or copper alloy to enhance adhesion of molding compound to it. The leadframe is oxidized in an oxidation treatment bath to form copper oxide on the surface of the leadframe. It is then dipped in a complexing or chelating agent to enhance the purity of the copper oxide formed. Thereafter, the leadframe is cleaned with an acid to remove any contaminants remaining on the leadframe.
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