Invention Application
- Patent Title: STENT SYSTEMS
- Patent Title (中): STENT系统
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Application No.: US11957211Application Date: 2007-12-14
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Publication No.: US20080221666A1Publication Date: 2008-09-11
- Inventor: David Licata , Sudip Pandya , William R. George , Roman Turovskiy , Dai T. Ton , James C. Liu
- Applicant: David Licata , Sudip Pandya , William R. George , Roman Turovskiy , Dai T. Ton , James C. Liu
- Applicant Address: US CA Sunnyvale
- Assignee: CardioMind, Inc.
- Current Assignee: CardioMind, Inc.
- Current Assignee Address: US CA Sunnyvale
- Main IPC: A61F2/06
- IPC: A61F2/06
Abstract:
Medical devices and methods for delivery or implantation of prostheses within hollow body organs and vessels or other luminal anatomy are disclosed. The subject technologies can be used in the treatment of atherosclerosis in stenting procedures or be used in variety of other procedures. The systems can employ a self expanding stent restrained by one or more members released by an electrolytically erodable latch.
Information query
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