发明申请
- 专利标题: SUPPLY METHOD AND SUPPLY APPARATUS OF SEMI-SOLID METAL
- 专利标题(中): 半固体金属的供应方法和供应设备
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申请号: US12046117申请日: 2008-03-11
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公开(公告)号: US20080223540A1公开(公告)日: 2008-09-18
- 发明人: Kenji Ohwada , Tomonori Sakai , Tsuyoshi Kimura , Koichi Kuroki
- 申请人: Kenji Ohwada , Tomonori Sakai , Tsuyoshi Kimura , Koichi Kuroki
- 申请人地址: JP Tokyo
- 专利权人: HONDA MOTOR CO., LTD.
- 当前专利权人: HONDA MOTOR CO., LTD.
- 当前专利权人地址: JP Tokyo
- 优先权: JP2007-068468 20070316
- 主分类号: B22D27/09
- IPC分类号: B22D27/09 ; B22D17/20
摘要:
A supply apparatus supplies a semi-solid metal to a molding apparatus having an injection sleeve formed with an opening portion and a plunger provided progressively/regressively at an inner portion of the injection sleeve. The supply apparatus includes a crucible in a shape of a cylinder containing a semi-solid metal, a carry arm for grabbing to move the crucible, and a control apparatus for controlling the carry arm. The control apparatus inserts a front end portion of a gutter mounted to the crucible into the opening portion of the injection sleeve by a predetermined angle to inject the semi-solid metal to a side of a direction of advancing the plunger more than at a position formed with the opening portion at inside of the injection sleeve.
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