发明申请
- 专利标题: LIQUID COOLING SYSTEM
- 专利标题(中): 液体冷却系统
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申请号: US12046187申请日: 2008-03-11
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公开(公告)号: US20080223552A1公开(公告)日: 2008-09-18
- 发明人: Hitoshi Onishi , Jiro Nakajima
- 申请人: Hitoshi Onishi , Jiro Nakajima
- 优先权: JP2007-061507 20070312
- 主分类号: F28F7/00
- IPC分类号: F28F7/00
摘要:
A liquid cooling system includes a heat-radiating sheet having a pair of heat-conductive metal plates that are superimposed on each other, and having a circulating flow passage between the pair of heat-conductive metal plates; a plurality of heat-receiving areas partitioned on the heat-radiating sheet; a plurality of heat-generating elements installed on each of the heat-receiving areas via a heat spreader made of a heat-conductive material; an inlet hole and an outlet hole opened to the surface of the heat-radiating sheet and located at both ends of the circulating flow passage; a pump having a discharge port and a suction port that communicate with the inlet hole and the outlet hole, and installed on the heat-radiating sheet; and a radiator continuous with the circulating flow passage of the heat-radiating sheet.