The invention relates to a method of making a brazed micro-channel cold plate assembly for cooling a heat producing electronic component. The primary components of a cold plate assembly are a base plate, a manifold cover, and inlet/outlet pipes; wherein the individual components are assembled and brazed into an integral unit. The joining surfaces of the individual components have novel features that provide for permanent bonding of the joints by brazing and a hermetic seal along the joint seams. The novel features also forestall excess braze alloy from contaminating the interior surfaces of the assembled cold plate and obstructing the engineered flow channels.