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发明申请
US20080230515A1 Power module member manufactured by wet treatment, and wet treatment method and wet treatment equipment thereof 审中-公开
通过湿式处理制造的电力模块部件，湿式处理方法及其湿式处理设备

Power module member manufactured by wet treatment, and wet treatment method and wet treatment equipment thereof
摘要：
The present invention provides a method of forming a circuit pattern on an integrally bonded member, the method not requiring a correction step of a laminate film or a resist film which has been necessary at the time of wet treatment of the integrally bonded member. After a circuit pattern forming metal plate is bonded on a part of a ceramic substrate so as to expose an outer peripheral edge portion of the ceramic substrate in an integrally bonded member, the integrally bonded member is set on a treating apparatus while being covered with a masking member having a window portion from which the circuit pattern forming metal plate of the integrally bonded member is exposed. Further, the integrally bonded member is pressed with an appropriate pressure from a base plate side so that a boundary surface between a portion surrounding the window portion in the masking member and an exposed surface of the ceramic substrate which is exposed in a metal-ceramic bonded member has a state not allowing a liquid to pass therethrough. Thereafter, a treatment solution for wet treatment is injected from an injection pipe to be in contact with the circuit pattern forming metal plate.
摘要（中）：

本发明提供了在整体接合部件上形成电路图案的方法，该方法不需要在整体接合部件进行湿处理时必需的层压膜或抗蚀剂膜的校正步骤。 在电路图案形成用金属板接合在陶瓷基板的一部分上，以将整体接合部件露出陶瓷基板的外周缘部之后，将整体接合部件设置在处理装置上，同时被覆盖 掩模构件具有窗口部分，整体结合构件的电路图案形成金属板从该窗口部分露出。 此外，整体结合部件从基板侧以适当的压力被按压，使得掩蔽部件中的窗部分周围的部分与陶瓷基板的暴露在金属 - 陶瓷结合的表面之间的边界面 构件具有不允许液体通过的状态。 此后，从喷射管注入用于湿处理的处理液，以与电路图形形成金属板接触。

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