发明申请
- 专利标题: Silicon Wafer For Semiconductor With Powersupply System on the Backside of Wafer
- 专利标题(中): 晶圆背面的供电系统半导体硅晶片
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申请号: US12089880申请日: 2006-10-13
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公开(公告)号: US20080231345A1公开(公告)日: 2008-09-25
- 发明人: Hyo-Jun Ahn , Ki-Won Kim , Jou-Hyeon Ahn , Tae-Hyun Nam , Kwon-Koo Cho , Hwa-Beom Shin , Hyun-Chil Choi , Gyu-Bong Cho , Tae-Bum Kim , Ho-Suk Ryu , Won-Cheol Shin , Jong-Seon Kim
- 申请人: Hyo-Jun Ahn , Ki-Won Kim , Jou-Hyeon Ahn , Tae-Hyun Nam , Kwon-Koo Cho , Hwa-Beom Shin , Hyun-Chil Choi , Gyu-Bong Cho , Tae-Bum Kim , Ho-Suk Ryu , Won-Cheol Shin , Jong-Seon Kim
- 优先权: KR10-2005-0117648 20051205
- 国际申请: PCT/KR2006/004154 WO 20061013
- 主分类号: H03K3/01
- IPC分类号: H03K3/01
摘要:
Disclosed is a semiconductor silicon wafer having an electric power supply affixed to the backside of the wafer. By fabricating the electric power supply onto the backside of the wafer that has been left unused, the semiconductor chip can have a self-supplied power, realizing the self-powered semiconductor chip with an increased efficiency. Further, since the electric power supply is installed on the wafer, not the semiconductor chip, the fabrication procedure becomes very simple, and the battery can be mounted on any type of chip.
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