Invention Application
- Patent Title: THIN FILM DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Patent Title (中): 薄膜装置及其制造方法
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Application No.: US12053317Application Date: 2008-03-21
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Publication No.: US20080236885A1Publication Date: 2008-10-02
- Inventor: Toshiyuki YOSHIZAWA , Masaomi ISHIKURA , Masahiro MIYAZAKI , Akira FURUYA , Nobuyuki OKUZAWA
- Applicant: Toshiyuki YOSHIZAWA , Masaomi ISHIKURA , Masahiro MIYAZAKI , Akira FURUYA , Nobuyuki OKUZAWA
- Applicant Address: JP Tokyo
- Assignee: TDK CORPORATION
- Current Assignee: TDK CORPORATION
- Current Assignee Address: JP Tokyo
- Priority: JP2007-093849 20070330
- Main IPC: H01L23/28
- IPC: H01L23/28

Abstract:
A terminal electrode body on a substrate is exposed relative to a resin layer, protruding out beyond the side of the resin layer. That is, the terminal electrode body is not covered by the resin layer. The electronic element is covered by an insulating layer and the terminal electrode body and the electronic element are electrically connected. Hence, an electric signal applied to the terminal electrode body can be transmitted to the electronic element. A cover layer covers the terminal electrode body and the boundary between the terminal electrode body and the resin layer.
Public/Granted literature
- US07683269B2 Thin film device and method for manufacturing the same Public/Granted day:2010-03-23
Information query
IPC分类: