发明申请
- 专利标题: Electronic Device with an Elevating Mechanism
- 专利标题(中): 具有升降机构的电子装置
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申请号: US11840218申请日: 2007-08-17
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公开(公告)号: US20080237556A1公开(公告)日: 2008-10-02
- 发明人: Chung-Hsien Chin , Cho-Keng Wu
- 申请人: Chung-Hsien Chin , Cho-Keng Wu
- 优先权: TW096110372 20070326
- 主分类号: B66F3/08
- IPC分类号: B66F3/08
摘要:
An electronic device with an elevating mechanism includes a body and the elevating mechanism connected with the body. The elevating mechanism includes a support base, an elevating element, and a fastening element. The elevating element capable of moving between a first position and a second position relative to the support base is connected with both the support base and the body. The elevating element includes a first wedging component. The fastening element disposed around the second position relative to the support base is rotatable between a third position and a fourth position. The fastening element includes a second wedging component. When the fastening element is rotated to the fourth position, the second wedging component is wedged on the first wedging component for fastening the elevating element at the second position.
公开/授权文献
- US07748668B2 Electronic device with an elevating mechanism 公开/授权日:2010-07-06
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