发明申请
- 专利标题: SEMICONDUCTOR DEVICE
- 专利标题(中): 半导体器件
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申请号: US11692637申请日: 2007-03-28
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公开(公告)号: US20080237891A1公开(公告)日: 2008-10-02
- 发明人: Roland Irsigler , Steve Wood , Hermann Ruckerbauer , Richard Johannes Luyken , Carsten Niepelt
- 申请人: Roland Irsigler , Steve Wood , Hermann Ruckerbauer , Richard Johannes Luyken , Carsten Niepelt
- 申请人地址: DE Muenchen
- 专利权人: QIMONDA AG
- 当前专利权人: QIMONDA AG
- 当前专利权人地址: DE Muenchen
- 主分类号: H01L23/48
- IPC分类号: H01L23/48
摘要:
A semiconductor device having a stacked arrangement of a substrate and a first chip and a second chip is disclosed. In one embodiment, the first chip is arranged with a lower face on an upper face of the substrate; the second chip with a lower face on an upper face of the first chip, whereby a partial area of the upper face of the first chip that is adjacent to an edge of the first chip is uncovered by the second chip; a fifth wire contact pad is arranged on the uncovered area of the upper face of the first chip; a first bonding wire is arranged that is connected with a first wire contact pad of the substrate and the fifth wire contact pad of the first chip.
公开/授权文献
- US07638869B2 Semiconductor device 公开/授权日:2009-12-29