A power floor tile assembly and method for providing power to furniture components via a floor structure, the tile assembly including a plurality of floor tiles, each tile including a substantially rigid supporting substrate member that includes top and bottom surfaces and an edge, at least a first conductive tile contact supported by the substrate member and extending to an exposed end and a covering layer having top and bottom surfaces and a thickness dimension between the top and bottom surfaces, the covering layer forming a separate opening for each of the tile contacts, the openings aligned with the tile contacts so that each tile contact extends through a separate one of the openings, the covering layer having a thickness dimension between the top and bottom surfaces such that the exposed end of each tile contact protrudes past the top surface of the covering layer, wherein each supporting substrate and associated covering layer are shaped such that the tile can be arranged with other tiles in side by side fashion to provide a substantially contiguous floor structure.