A fan module is disclosed. The fan module includes a base, at least one first side coupled to the base, and a plurality of fans coupled to the base. The plurality of fans are configured to substantially disperse thermal energy away from one or more electronic components in an enclosure to maintain a current temperature of the one or more electronic components below a critical temperature. The fan module further includes a connector mounted on the at least one first side and coupled to provide power to the plurality of fans. When one of the plurality of fans ceases to operate, the remaining fans in the plurality of fans continue to substantially disperse thermal energy away from the one or more electronic components while maintaining the current temperature below the critical temperature.