发明申请
US20080242531A1 ALUMINUM NITRIDE SINTERED BODY AND SEMICONDUCTOR MANUFACTURING APPARATUS MEMBER 有权
氮化铝烧结体和半导体制造装置

  • 专利标题: ALUMINUM NITRIDE SINTERED BODY AND SEMICONDUCTOR MANUFACTURING APPARATUS MEMBER
  • 专利标题(中): 氮化铝烧结体和半导体制造装置
  • 申请号: US12054715
    申请日: 2008-03-25
  • 公开(公告)号: US20080242531A1
    公开(公告)日: 2008-10-02
  • 发明人: Naomi TerataniYuji Katsuda
  • 申请人: Naomi TerataniYuji Katsuda
  • 申请人地址: JP Nagoya-Shi
  • 专利权人: NGK Insulators, Ltd.
  • 当前专利权人: NGK Insulators, Ltd.
  • 当前专利权人地址: JP Nagoya-Shi
  • 优先权: JP2007-080697 20070327
  • 主分类号: C04B35/00
  • IPC分类号: C04B35/00
ALUMINUM NITRIDE SINTERED BODY AND SEMICONDUCTOR MANUFACTURING APPARATUS MEMBER
摘要:
The aluminum nitride sintered body includes at least europium (Eu), aluminum (Al), and oxygen (O). It was found that a grain boundary phase having a peak having a X-ray diffraction profile substantially the same as that of an Sr3Al2O6 phase could be three-dimensionally continued in the aluminum nitride sintered body to realize a lower resistance without damaging various properties unique to aluminum nitride.
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