发明申请
- 专利标题: ELECTRICAL CONNECTOR LEAD FRAME
- 专利标题(中): 电气连接器引线框架
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申请号: US12062581申请日: 2008-04-04
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公开(公告)号: US20080248658A1公开(公告)日: 2008-10-09
- 发明人: Thomas S. Cohen , Brian Kirk , Jason E. Chan , Andreas C. Pfahnl , Marc B. Cartier , David Manter
- 申请人: Thomas S. Cohen , Brian Kirk , Jason E. Chan , Andreas C. Pfahnl , Marc B. Cartier , David Manter
- 主分类号: H01R12/00
- IPC分类号: H01R12/00 ; H01R13/02
摘要:
An electrical interconnection system with high speed, differential electrical connectors. The connector is assembled from wafers containing columns of conductive elements, some of which form differential pairs. Each column may include ground conductors adjacent pairs of signal conductors. The ground conductors may be wider than the signal conductors, with ground conductors between adjacent pairs of signal conductors being wider than ground conductors positioned at an end of at least some of the columns. Each of the conductive elements may end in a mating contact portion positioned to engage a complementary contact element in a mating connector. The mating contact portions of the signal conductors in some of the pairs may be rotated relative to the columns. The printed circuit board to which the differential signal connector is mounted may be constructed with elongated antipads around pairs of signal conductors.
公开/授权文献
- US07794278B2 Electrical connector lead frame 公开/授权日:2010-09-14