发明申请
US20080251739A1 OPTICAL COUPLER PACKAGE 有权
光耦合器

OPTICAL COUPLER PACKAGE
摘要:
A method is disclosed. The method includes forming a substrate with a leadframe and a molding compound. The molding compound fills internal spaces in the leadframe and forms a dam structure. An optical emitter and an optical receiver are placed on the substrate. An optically transmissive medium is formed between the optical emitter and optical receiver.
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