发明申请
US20080251795A1 Photoelectric element package with temperature compensation 有权
带温度补偿的光电元件封装

Photoelectric element package with temperature compensation
摘要:
A photoelectric element package with temperature compensation includes a substrate, and a first light-emitting element, a second light-emitting element, a photosensitive element, and a drive element disposed on the substrate, all of which are disposed in an internal space formed by a first casing joined with a second casing. Alternatively, the second light-emitting element and the photosensitive element are disposed in an internal space of a third casing. By adding the second light-emitting element, the photosensitive element can sense the light emitting intensity accurately in the absence of other interferences, so as to feed back the current operating state of the light-emitting element. A temperature compensation function is achieved by a laser driver, so as to reduce the influence of temperature on the light-emitting element, such that the light-emitting element emits light in an accurate intensity.
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