发明申请
- 专利标题: Photoelectric element package with temperature compensation
- 专利标题(中): 带温度补偿的光电元件封装
-
申请号: US11878561申请日: 2007-07-25
-
公开(公告)号: US20080251795A1公开(公告)日: 2008-10-16
- 发明人: Wen-Ping Yu
- 申请人: Wen-Ping Yu
- 专利权人: AmTRAN TECHNOLOGY CO., LTD.
- 当前专利权人: AmTRAN TECHNOLOGY CO., LTD.
- 优先权: TW096113138 20070413
- 主分类号: H01L31/12
- IPC分类号: H01L31/12
摘要:
A photoelectric element package with temperature compensation includes a substrate, and a first light-emitting element, a second light-emitting element, a photosensitive element, and a drive element disposed on the substrate, all of which are disposed in an internal space formed by a first casing joined with a second casing. Alternatively, the second light-emitting element and the photosensitive element are disposed in an internal space of a third casing. By adding the second light-emitting element, the photosensitive element can sense the light emitting intensity accurately in the absence of other interferences, so as to feed back the current operating state of the light-emitting element. A temperature compensation function is achieved by a laser driver, so as to reduce the influence of temperature on the light-emitting element, such that the light-emitting element emits light in an accurate intensity.
公开/授权文献
- US07772608B2 Photoelectric element package with temperature compensation 公开/授权日:2010-08-10
信息查询
IPC分类: