发明申请
- 专利标题： Semiconductor Module
- 专利标题（中）： 半导体模块
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申请号： US11733658申请日： 2007-04-10
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公开(公告)号： US20080251859A1公开(公告)日： 2008-10-16
- 发明人: Ralf Otremba , Lutz Goergens , Gerhard Noebauer , Charlie Tan Tien Lai , Erwin Huber , Marco Puerschel , Gilles Delarozee , Markus Dinkel
- 申请人： Ralf Otremba , Lutz Goergens , Gerhard Noebauer , Charlie Tan Tien Lai , Erwin Huber , Marco Puerschel , Gilles Delarozee , Markus Dinkel
- 主分类号： H01L27/088
- IPC分类号： H01L27/088 ; H01L21/58 ; H01L23/48
摘要：
A component includes a first semiconductor chip attached to a first carrier and second semiconductor chip attached to a second carrier. The first carrier has a first extension, which forms a first external contact element. The second carrier has a second extension, which forms a second external contact element. The first and the second carriers are arranged in such a way that the first and the second extension point in different directions.
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