- 专利标题: Solid state device and light-emitting element
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申请号: US12155820申请日: 2008-06-10
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公开(公告)号: US20080252212A1公开(公告)日: 2008-10-16
- 发明人: Yoshinobu Suehiro , Masayoshi Ichikawa , Satoshi Wada , Koji Tasumi
- 申请人: Yoshinobu Suehiro , Masayoshi Ichikawa , Satoshi Wada , Koji Tasumi
- 申请人地址: JP Nishikasugai-gun
- 专利权人: TOYODA GOSEI CO., LTD.
- 当前专利权人: TOYODA GOSEI CO., LTD.
- 当前专利权人地址: JP Nishikasugai-gun
- 优先权: JP2004-263097 20040909; JP2004-316007 20041029
- 主分类号: H01J1/88
- IPC分类号: H01J1/88
摘要:
A solid-state device having: a flip-chip mounted solid-state element; a power receiving/feeding portion having a mounting substrate to allow that a mounting surface of the solid-state element forms substantially the same plane as a surface of the mounting substrate; and an inorganic sealing portion made of an inorganic sealing material having a thermal expansion coefficient equal to that of the power receiving/feeding portion for sealing the solid-state element.