The disclosure relates to a jack assembly including a jack mount for slidably receiving a jack that includes a plurality of conductive tip and ring springs. When plugs are received, the tip springs make electrical contact with tip contacts of the plugs and the ring springs make electrical contact with ring contacts of the plugs. When plugs are not received, the tip and ring springs make contact with normal contacts of the jack. The jack assembly also includes cross-connect contacts and a rear interface assembly. The rear interface assembly includes a dielectric support and a plurality of coaxial connectors projecting outwardly therefrom away from the jack mount. A circuit board is positioned between the jack mount and the dielectric support. The coaxial connectors are electrically connected to baluns mounted on a second circuit board mounted within the dielectric support. The second board is electrically connected to the first board by dual compliant pins. Electrical connections are established between the coaxial connectors and the tip and ring springs when the rear interface assembly is secured to the jack mount.