发明申请
- 专利标题： COPPER-TIN-OXYGEN ALLOY PLATING
- 专利标题（中）： 铜 - 氧合金镀层
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申请号： US12132812申请日： 2008-06-04
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公开(公告)号： US20080257745A1公开(公告)日： 2008-10-23
- 发明人: Kazuya URATA , Kazuhito KITAGAWA , Yukio OGAWA , Kenji KASEGAWA
- 申请人： Kazuya URATA , Kazuhito KITAGAWA , Yukio OGAWA , Kenji KASEGAWA
- 申请人地址： JP Tokyo JP Tokyo
- 专利权人： NIHON NEW CHROME CO., LTD.,YKK SNAP FASTENERS JAPAN CO., LTD.
- 当前专利权人： NIHON NEW CHROME CO., LTD.,YKK SNAP FASTENERS JAPAN CO., LTD.
- 当前专利权人地址： JP Tokyo JP Tokyo
- 优先权： JP2002-173078 20020613
- 主分类号： C25D3/58
- IPC分类号： C25D3/58
摘要：
The present invention relates to a Cu—Sn—O alloy plating having an oxygen content of 0.3 to 50 at %, a copper content of 20 to 80 at %, and a tin content of 10 to 70 at % in the plating. The present invention provides a copper tin alloy plating that has excellent plating adhesion and disengaging force stability and particularly a Cu—Sn—O alloy plating that has a blackish color tone without containing any controlled substances.
公开/授权文献
- US07867625B2 Copper-tin-oxygen alloy plating 公开/授权日：2011-01-11
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