发明申请
- 专利标题： CONNECTING MICROSIZED DEVICES USING ABLATIVE FILMS
- 专利标题（中）： 使用压缩薄膜连接微型器件
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申请号： US11737187申请日： 2007-04-19
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公开(公告)号： US20080258313A1公开(公告)日： 2008-10-23
- 发明人: M. Zaki Ali , A. Peter Stolt , Gilbert A. Hawkins , Thomas M. Stephany
- 申请人： M. Zaki Ali , A. Peter Stolt , Gilbert A. Hawkins , Thomas M. Stephany
- 主分类号： H01L23/48
- IPC分类号： H01L23/48 ; H01L21/58
摘要：
A method of providing connectivity to a microsized device, the method includes the steps of providing an ablative base material having at least a top surface; providing a die having a first and second surface and having bonding pads at least upon the first surface; placing the die with the at least first surface of the die contacting the at least first surface of the ablative base material; and ablating a channel in the ablative material proximate to the die.
公开/授权文献
- US07696013B2 Connecting microsized devices using ablative films 公开/授权日：2010-04-13
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