Invention Application
- Patent Title: FABRIC TYPE SEMICONDUCTOR DEVICE PACKAGE AND METHODS OF INSTALLING AND MANUFACTURING SAME
- Patent Title (中): 织物型半导体器件封装及其安装和制造方法
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Application No.: US12037203Application Date: 2008-02-26
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Publication No.: US20080258314A1Publication Date: 2008-10-23
- Inventor: Hoi-Jun Yoo , Yongsang KIM , Hyejung KIM
- Applicant: Hoi-Jun Yoo , Yongsang KIM , Hyejung KIM
- Priority: KR10-2007-0037792 20070418; KR10-2008-0002949 20080110
- Main IPC: H01L23/49
- IPC: H01L23/49 ; H01L21/56
Abstract:
A fabric type semiconductor device package is provided. The fabric type semiconductor device package comprises a fabric type printed circuit board comprising a fabric and a lead unit formed by patterning a conductive material on the fabric, a semiconductor device comprising an electrode unit bonded to the lead unit of the fabric type printed circuit board, and a molding unit for sealing the fabric type printed circuit board and the semiconductor device. In the fabric type semiconductor device package according to the present invention, a fabric type printed circuit board formed of fabric is used so that a feeling of an alien substance can be minimized. The fabric type semiconductor device package can be easily installed. The productivity of the fabric type semiconductor device package can be improved.
Public/Granted literature
- US07638885B2 Fabric type semiconductor device package and methods of installing and manufacturing same Public/Granted day:2009-12-29
Information query
IPC分类:
