发明申请
- 专利标题: Magnetic disk drive and soldering method of feed-through
- 专利标题(中): 磁盘驱动器和馈通焊接方法
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申请号: US12148697申请日: 2008-04-21
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公开(公告)号: US20080259503A1公开(公告)日: 2008-10-23
- 发明人: Akihiko Aoyagi , Teruhiro Nakamiya , Takashi Kouno , Hitoshi Shindo , Tetsuya Nakatsuka
- 申请人: Akihiko Aoyagi , Teruhiro Nakamiya , Takashi Kouno , Hitoshi Shindo , Tetsuya Nakatsuka
- 优先权: JP2007-110485 20070419
- 主分类号: G11B5/48
- IPC分类号: G11B5/48
摘要:
Embodiments of the present invention help to achieve a solder joining structure having high reliability, in which even if a componential material of a flange of a feed-through of a sealed magnetic disk drive is an iron-based material such as kovar, and a componential material of a base of the drive is an aluminum-based alloy, leakage of low-density gas is dramatically reduced. According to one embodiment, a base has a stepped portion in the inside of a periphery of an opening, and an inclined surface extending to the outside of the base is formed at an edge of a surface of the stepped portion, on which a flange of a feed-through is placed, thereby when the stepped portion of the base is joined by soldering with the flange of the feed-through, a solder fillet is formed not only in the inside of the base, but also in the outside thereof.
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