发明申请
- 专利标题： Capacitor and manufacturing method thereof
- 专利标题（中）： 电容及其制造方法
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申请号： US12078648申请日： 2008-04-02
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公开(公告)号： US20080259523A1公开(公告)日： 2008-10-23
- 发明人: Sung-Taek LIM , Yul-Kyo CHUNG , Woon-Chun KIM
- 申请人： Sung-Taek LIM , Yul-Kyo CHUNG , Woon-Chun KIM
- 申请人地址： KR Suwon
- 专利权人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人地址： KR Suwon
- 优先权： KR10-2007-0037740 20070418
- 主分类号： H01G4/06
- IPC分类号： H01G4/06 ; H01G4/20 ; H01G7/00
摘要：
A capacitor and a method of manufacturing the capacitor are disclosed. The capacitor may include a board, a polymer layer formed on one side of the board, a circuit pattern selectively formed over the polymer layer, and a titania nanosheet corresponding with the circuit pattern. Embodiments of the invention can provide flatness in the board, and allows the copper of the board to maintain its functionality as an electrode while increasing the adhesion to the titania nanosheet. The titania nanosheet may thus be implemented on a patterned board in a desired shape, number of layers, and thickness.
公开/授权文献
- US08199456B2 Capacitor and manufacturing method thereof 公开/授权日：2012-06-12
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