发明申请
- 专利标题： Structure and Methods of Processing for Solder Thermal Interface Materials for Chip Cooling
- 专利标题（中）： 用于芯片冷却的焊料热界面材料的加工结构和方法
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申请号： US11742161申请日： 2007-04-30
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公开(公告)号： US20080265404A1公开(公告)日： 2008-10-30
- 发明人: Bruce Furman , Madhusudan K. Iyengar , Paul A. Lauro , Yves Martin , Roger R. Schmidt , Da-Yuan Shih , Theodore G. Van Kessel , Wei Zou
- 申请人： Bruce Furman , Madhusudan K. Iyengar , Paul A. Lauro , Yves Martin , Roger R. Schmidt , Da-Yuan Shih , Theodore G. Van Kessel , Wei Zou
- 申请人地址： US NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： US NY Armonk
- 主分类号： H01L23/34
- IPC分类号： H01L23/34 ; H01L21/00
摘要：
Assemblies for dissipating heat from integrated circuits and circuit chips are disclosed. The assemblies include a low melt solder as a thermal interface material (TIM) for the transfer of heat from a chip to a heat sink (HS), wherein the low melt solder has a melting point below the maximum operating temperature of the chip. Methods for making the assemblies are also disclosed.
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