发明申请
US20080265872A1 WIRING SUBSTRATE AND CURRENT DETECTION DEVICE 审中-公开
接线基板和电流检测装置

  • 专利标题: WIRING SUBSTRATE AND CURRENT DETECTION DEVICE
  • 专利标题(中): 接线基板和电流检测装置
  • 申请号: US12108780
    申请日: 2008-04-24
  • 公开(公告)号: US20080265872A1
    公开(公告)日: 2008-10-30
  • 发明人: Atsushi Nagashima
  • 申请人: Atsushi Nagashima
  • 申请人地址: JP Kyoto-shi
  • 专利权人: OMRON CORPORATION
  • 当前专利权人: OMRON CORPORATION
  • 当前专利权人地址: JP Kyoto-shi
  • 优先权: JP2007-118731 20070427
  • 主分类号: G01R1/20
  • IPC分类号: G01R1/20
WIRING SUBSTRATE AND CURRENT DETECTION DEVICE
摘要:
An object of the present invention is to provide a wiring substrate capable of accurately detecting a potential difference in a shunt resistor and a current to be detected without being influenced by soldering, and a current detection device. A land mounted with a rectangular surface at each end of a shunt resistor is configured by first and second lands each having a rectangular portion and being arranged at a predetermined interval with a central line as a center, and third and fourth lands each having an area smaller than those of the first and second lands and being arranged at one end of the first and second lands to be connected respectively to the first and second lands. A wiring pattern for detecting a potential difference between the both ends of the shunt resistor is configured by a first wiring pattern connected to the third land and pulled out from the third land towards the fourth land, a second wiring pattern connected to the fourth land and pulled out from the fourth land towards the third land, and third and fourth wiring patterns connected respectively to the first and second wiring patterns and pulled out into one direction.
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