发明申请
- 专利标题: Electromagnetic bandgap structure and printed circuit board
- 专利标题(中): 电磁带隙结构和印刷电路板
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申请号: US12010558申请日: 2008-01-25
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公开(公告)号: US20080266026A1公开(公告)日: 2008-10-30
- 发明人: Mi-Ja Han , Han Kim , Dae-Hyun Park , Jae-Joon Lee
- 申请人: Mi-Ja Han , Han Kim , Dae-Hyun Park , Jae-Joon Lee
- 申请人地址: KR Suwon-si
- 专利权人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人地址: KR Suwon-si
- 优先权: KR10-2007-0041989 20070430
- 主分类号: H03H7/00
- IPC分类号: H03H7/00
摘要:
An electromagnetic bandgap structure and a printed circuit board that can solve a mixed signal problem between an analog circuit and a digital circuit are disclosed. In accordance with an embodiment of the present invention, the electromagnetic bandgap structure can include a first metal layer; a first dielectric layer, stacked in the first metal layer; a metal plate, stacked in the first dielectric layer; a via, connecting the first metal layer to the metal plate; a second dielectric layer, stacked in the metal plate and the first dielectric layer; and a second metal layer, stacked in the second dielectric layer. Here, a hole can be formed on the metal plate. With the present invention, the electromagnetic bandgap structure can lower a noise level more within the same frequency band as compared with other structures having the same size.
公开/授权文献
- US07965521B2 Electromagnetic bandgap structure and printed circuit board 公开/授权日:2011-06-21
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