发明申请
US20080272449A1 Solid-state image pickup device, solid-state image pickup device manufacturing method and camera
审中-公开
固态图像拾取装置，固态图像拾取装置制造方法和相机
- 专利标题： Solid-state image pickup device, solid-state image pickup device manufacturing method and camera
- 专利标题（中）： 固态图像拾取装置，固态图像拾取装置制造方法和相机
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申请号： US11665601申请日： 2005-10-14
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公开(公告)号： US20080272449A1公开(公告)日： 2008-11-06
- 发明人: Yuichi Inaba , Masahiro Kasano
- 申请人： Yuichi Inaba , Masahiro Kasano
- 优先权： JP2004-312927 20041027
- 国际申请： PCT/JP2005/018976 WO 20051014
- 主分类号： H01L31/00
- IPC分类号： H01L31/00 ; H01L21/00
摘要：
A solid-state image pickup device 1 has a construction in which a P-type semiconductor layer 102, an insulating layer 104, a color filter 106, a light transmitting layer 107, and a light focusing layer 108 are sequentially laminated on an N-type semiconductor layer 101. A plurality of photodiodes 103 are formed in the P-type semiconductor layer 102 on the insulating layer 104 side. A light shielding film 105 is formed in the insulating layer 104. The plurality of photodiodes 103 are densely mounted by being unequally arranged two-dimensionally. The light-focusing efficiency can be improved because the plurality of photodiodes 103 closely arranged to each other share the light transmitting layer 107 and the light focusing layer 108.
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